SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing chip cost by reducing a chip area.SOLUTION: An outer shape of a semiconductor substrate 1 is pentagonal. A pre-stage amplifier 4 is formed at one apex 2a side of the pentagon of the semiconductor substrate 1. Post-stage ampl...
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing chip cost by reducing a chip area.SOLUTION: An outer shape of a semiconductor substrate 1 is pentagonal. A pre-stage amplifier 4 is formed at one apex 2a side of the pentagon of the semiconductor substrate 1. Post-stage amplifiers 5 and 6 that amplify an output of the pre-stage amplifier 4 are formed at a side 3a side opposed to the apex 2a of the semiconductor substrate 1.SELECTED DRAWING: Figure 1
【課題】チップ面積を縮小してチップコストを削減することができる半導体装置を得る。【解決手段】半導体基板１の外形が五角形である。前段増幅器４が半導体基板１の五角形の１つの頂点２ａ側に形成されている。前段増幅器４の出力を増幅する後段増幅器５，６が半導体基板１の頂点２ａに対向する辺３ａ側に形成されている。【選択図】図１ |
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