ETCHING APPARATUS

PROBLEM TO BE SOLVED: To provide an etching apparatus which can perform a thickness measurement with high accuracy while preventing a thickness sensor from being damaged.SOLUTION: An etching apparatus comprises: a shield plate 4 to be disposed between a thickness sensor 3 and a semiconductor wafer 1...

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Bibliographische Detailangaben
Hauptverfasser:	OTA HIROYUKI, TSUZUKI YUJI, IMAI TOMOHITO, MIYASHITA KOICHI, SHIMIZU TAKAYUKI, SHIRAISHI MITSUHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an etching apparatus which can perform a thickness measurement with high accuracy while preventing a thickness sensor from being damaged.SOLUTION: An etching apparatus comprises: a shield plate 4 to be disposed between a thickness sensor 3 and a semiconductor wafer 1. Of the shield plate 4, a part which light emitted from the thickness sensor 3 travels through makes an inclined plane tilted with respect to a direction of the light emission. This makes possible to measure a thickness with high accuracy while preventing the thickness sensor 3 from being damaged.SELECTED DRAWING: Figure 1 【課題】厚みセンサの損傷を防ぎつつ、厚み測定が高精度に行えるエッチング装置を提供する。【解決手段】厚みセンサ３と半導体ウェハ１との間に遮蔽板４を備えると共に、遮蔽板４のうち厚みセンサ３から照射される光が透過する部分を光の照射方向に対して傾斜した傾斜面となるようにする。これにより、厚みセンサ３の損傷を防ぎつつ、厚み測定を高精度に行うことが可能となる。【選択図】図１