SILVER COAT COPPER POWDER
PROBLEM TO BE SOLVED: To provide a silver coat copper powder useful as not only a conductive material, but also a joint material.SOLUTION: The silver coat copper powder has core material particles of copper and silver coating at least a part of a surface of the core material particles. The silver co...
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| creator | SASAKI TAKASHI FURUMOTO KEITA |
| description | PROBLEM TO BE SOLVED: To provide a silver coat copper powder useful as not only a conductive material, but also a joint material.SOLUTION: The silver coat copper powder has core material particles of copper and silver coating at least a part of a surface of the core material particles. The silver coat copper powder has particle diameter of 100 nm to 500 nm. The silver in the silver coat copper powder has crystallite size of a (111) surface of 2 nm to 20 nm. The copper has preferably crystallite size of the (111) surface of 10 nm to 50 nm. Percentage of the silver in the whole is suitably 2 mass% to 50 mass%.SELECTED DRAWING: Figure 1
【課題】導電材料としてだけでなく、接合材料としても有用な銀コート銅粉を提供すること。【解決手段】本発明の銀コート銅粉は、銅の芯材粒子と、該芯材粒子の表面の少なくとも一部を被覆している銀とを有する。銀コート銅粉は、粒径が１００ｎｍ以上５００ｎｍ以下である。銀コート銅粉における銀は（１１１）面の結晶子サイズが２ｎｍ以上２０ｎｍ以下である。銅は（１１１）面の結晶子サイズが１０ｎｍ以上５０ｎｍであることが好適である。全体に占める銀の割合が２質量％以上５０質量％以下であることも好適である。【選択図】図１ |
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【課題】導電材料としてだけでなく、接合材料としても有用な銀コート銅粉を提供すること。【解決手段】本発明の銀コート銅粉は、銅の芯材粒子と、該芯材粒子の表面の少なくとも一部を被覆している銀とを有する。銀コート銅粉は、粒径が１００ｎｍ以上５００ｎｍ以下である。銀コート銅粉における銀は（１１１）面の結晶子サイズが２ｎｍ以上２０ｎｍ以下である。銅は（１１１）面の結晶子サイズが１０ｎｍ以上５０ｎｍであることが好適である。全体に占める銀の割合が２質量％以上５０質量％以下であることも好適である。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CASTING ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; PERFORMING OPERATIONS ; POWDER METALLURGY ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; TRANSPORTING ; WORKING METALLIC POWDER</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171005&DB=EPODOC&CC=JP&NR=2017179555A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171005&DB=EPODOC&CC=JP&NR=2017179555A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SASAKI TAKASHI</creatorcontrib><creatorcontrib>FURUMOTO KEITA</creatorcontrib><title>SILVER COAT COPPER POWDER</title><description>PROBLEM TO BE SOLVED: To provide a silver coat copper powder useful as not only a conductive material, but also a joint material.SOLUTION: The silver coat copper powder has core material particles of copper and silver coating at least a part of a surface of the core material particles. The silver coat copper powder has particle diameter of 100 nm to 500 nm. The silver in the silver coat copper powder has crystallite size of a (111) surface of 2 nm to 20 nm. The copper has preferably crystallite size of the (111) surface of 10 nm to 50 nm. Percentage of the silver in the whole is suitably 2 mass% to 50 mass%.SELECTED DRAWING: Figure 1
【課題】導電材料としてだけでなく、接合材料としても有用な銀コート銅粉を提供すること。【解決手段】本発明の銀コート銅粉は、銅の芯材粒子と、該芯材粒子の表面の少なくとも一部を被覆している銀とを有する。銀コート銅粉は、粒径が１００ｎｍ以上５００ｎｍ以下である。銀コート銅粉における銀は（１１１）面の結晶子サイズが２ｎｍ以上２０ｎｍ以下である。銅は（１１１）面の結晶子サイズが１０ｎｍ以上５０ｎｍであることが好適である。全体に占める銀の割合が２質量％以上５０質量％以下であることも好適である。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASTING</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>TRANSPORTING</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAM9vQJcw1ScPZ3DAESAQFAdoB_uItrEA8Da1piTnEqL5TmZlBycw1x9tBNLciPTy0uSExOzUstifcKMDIwNDc0tzQ1NXU0JkoRAFLZIH4</recordid><startdate>20171005</startdate><enddate>20171005</enddate><creator>SASAKI TAKASHI</creator><creator>FURUMOTO KEITA</creator><scope>EVB</scope></search><sort><creationdate>20171005</creationdate><title>SILVER COAT COPPER POWDER</title><author>SASAKI TAKASHI ; FURUMOTO KEITA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017179555A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASTING</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>TRANSPORTING</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>SASAKI TAKASHI</creatorcontrib><creatorcontrib>FURUMOTO KEITA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SASAKI TAKASHI</au><au>FURUMOTO KEITA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SILVER COAT COPPER POWDER</title><date>2017-10-05</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To provide a silver coat copper powder useful as not only a conductive material, but also a joint material.SOLUTION: The silver coat copper powder has core material particles of copper and silver coating at least a part of a surface of the core material particles. The silver coat copper powder has particle diameter of 100 nm to 500 nm. The silver in the silver coat copper powder has crystallite size of a (111) surface of 2 nm to 20 nm. The copper has preferably crystallite size of the (111) surface of 10 nm to 50 nm. Percentage of the silver in the whole is suitably 2 mass% to 50 mass%.SELECTED DRAWING: Figure 1
【課題】導電材料としてだけでなく、接合材料としても有用な銀コート銅粉を提供すること。【解決手段】本発明の銀コート銅粉は、銅の芯材粒子と、該芯材粒子の表面の少なくとも一部を被覆している銀とを有する。銀コート銅粉は、粒径が１００ｎｍ以上５００ｎｍ以下である。銀コート銅粉における銀は（１１１）面の結晶子サイズが２ｎｍ以上２０ｎｍ以下である。銅は（１１１）面の結晶子サイズが１０ｎｍ以上５０ｎｍであることが好適である。全体に占める銀の割合が２質量％以上５０質量％以下であることも好適である。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; jpn |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CASTING CONDUCTORS ELECTRICITY INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER PERFORMING OPERATIONS POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING WORKING METALLIC POWDER |
| title | SILVER COAT COPPER POWDER |
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