POLYIMIDE LAMINATE FILM
PROBLEM TO BE SOLVED: To provide a polyimide laminate film capable of suppressing crack generation due to alkali environment, when a flexible metal clad laminate is manufactured by using the polyimide laminate film and a flexible printed wiring board is continuously manufactured by a roll-to-roll me...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a polyimide laminate film capable of suppressing crack generation due to alkali environment, when a flexible metal clad laminate is manufactured by using the polyimide laminate film and a flexible printed wiring board is continuously manufactured by a roll-to-roll method.SOLUTION: There is provided a polyimide laminate film obtained by a manufacturing method including at least a process of laminating a thermoplastic polyamide acid manufactured from an acid anhydride component having a rigid component and diamine having the rigid component at least on one surface of non-thermoplastic polyimide, and conducting a heat treatment in a temperature range of a glass transition temperature Tg°C to (Tg+100)°C.SELECTED DRAWING: None
【課題】ポリイミド積層フィルムを用いるフレキシブル金属張積層板をロールツーロール式で連続的にフレキシブルプリント配線板を製造する際に、アルカリ環境下に起因するクラック発生を抑制できるポリイミド積層フィルムを提供することにある。【解決手段】非熱可塑性ポリイミドの少なくとも片面に，剛直成分を有する酸無水分と剛直成分を有するジアミンから製造される熱可塑性ポリアミド酸を積層し、ガラス転移温度Ｔｇ℃〜（Ｔｇ＋１００）℃の温度範囲で加熱処理を行う工程を少なくとも含む製造方法により得られるポリイミド積層フィルム。【選択図】なし |
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