ADHESIVE AND COMPOSITE CONJUGATE

PROBLEM TO BE SOLVED: To provide an adhesive having low dielectric constant and low dielectric loss tangent and capable of adhering a metal layer and a heat resistant resin layer rigidly and a composite conjugate by rigidly adhering the metal layer and the heat resistant resin layer by the additive....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHIBA OMICHI, OBARA TEIJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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