CARRIER AND PRINTED CIRCUIT BOARD TO BE ADHERED THE CARRIER

PROBLEM TO BE SOLVED: To provide a printed circuit board to which a carrier is adhered, and the carrier.SOLUTION: A printed circuit board to which a carrier according to an embodiment of the present invention is adhered, includes: a printed circuit board including a dummy region formed in a unit reg...

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Bibliographische Detailangaben
Hauptverfasser:	RYU JOUNG GUL, SOHN KEUNG JIN, PARK JUNG HWAN, CHOI IK JUN, SON KYO YOUNG
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed circuit board to which a carrier is adhered, and the carrier.SOLUTION: A printed circuit board to which a carrier according to an embodiment of the present invention is adhered, includes: a printed circuit board including a dummy region formed in a unit region to which a conductive patter is formed and a periphery of the unit region; and the carrier supporting the printed circuit board. The carrier includes a reinforcement layer; a separation type layer that is formed between the reinforcement layer and the unit region; and an adhesion layer that is formed between the reinforcement layer and the dummy region, and allows the reinforcement layer and the dummy region to be adhered.SELECTED DRAWING: Figure 2 【課題】本発明は、キャリアが付着されたプリント回路基板及びキャリアを提供する。【解決手段】本発明の実施例に係るキャリアが付着されたプリント回路基板は、伝導性パターンが形成されるユニット領域及びユニット領域の周辺に形成されるダミー領域を含むプリント回路基板と、上記プリント回路基板を支持するキャリアとを含み、上記キャリアは、補強層と、上記補強層と上記ユニット領域との間に形成される離型層と、上記補強層と上記ダミー領域との間に形成され、上記補強層と上記ダミー領域とを接着させる接着層と、を含む。【選択図】図２