PACKAGE SUBSTRATE

PROBLEM TO BE SOLVED: To provide a package substrate capable of increasing a transmission speed between electronic components.SOLUTION: In the package substrate, a first conductor layer 158Fa formed on the package substrate serves as a dedicated wiring layer for transmitting data between a first com...

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Bibliographische Detailangaben
1. Verfasser:	OZAKI ATSUSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a package substrate capable of increasing a transmission speed between electronic components.SOLUTION: In the package substrate, a first conductor layer 158Fa formed on the package substrate serves as a dedicated wiring layer for transmitting data between a first component and a second component. Striplines are formed on an outermost conductor layer 158Fb, the first conductor circuit 158Fa and the second conductor layer 58FP. The transmission characteristic of the first conductor circuit improves.SELECTED DRAWING: Figure 1 【課題】電子部品間の伝送速度を高くすることができるパッケージ基板の提供【解決手段】実施形態のパッケージ基板では、パッケージ基板内に形成されている第１導体層１５８Ｆａが第１電子部品と第２電子部品間のデータを伝送するための専用の配線層として機能する。最外の導体層１５８Ｆｂと第１導体回路１５８Ｆａと第２導体層５８ＦＰでストリップラインが形成される。第１導体回路の伝送特性が改善される。【選択図】図１