PACKAGE, METHOD FOR MANUFACTURING PACKAGE, PACKAGING BAG, AND USE OF PACKAGING BAG

PROBLEM TO BE SOLVED: To provide a package having an excellent pressure resistance.SOLUTION: A package comprises a front film, a back film, an adhesive layer provided on the front film, and an encapsulation seal provided on the back film. In the package, a mouth closing part is formed on one end sid...

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1. Verfasser: HAGIMOTO JUN
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a package having an excellent pressure resistance.SOLUTION: A package comprises a front film, a back film, an adhesive layer provided on the front film, and an encapsulation seal provided on the back film. In the package, a mouth closing part is formed on one end side in a longer direction and a sealing part is formed on the other end side in the longer direction. In the sealing part, the front film, the back film and the adhesive layer have a laminate structure I in which the adhesive layer, the front film, the back film, the back film, the front film, the front film, and the back film are laminated in this order in a thickness direction of the package, and a laminate structure II in which the adhesive layer, the back film, the front film, the front film, and the back film are laminated in this order, and the laminate structure I and the laminate structure II are covered by the encapsulation seal.SELECTED DRAWING: Figure 1 【課題】本願発明の目的は、耐圧性に優れる包装体を提供することにある。【解決手段】本願発明の包装体は、表面フィルム、裏面フィルム、前記表面フィルム上に設けられた粘着剤層、及び前記裏面フィルム上に設けられた封止シールを備え、長手方向一方端側に閉口部が形成され、長手方向他方端側に密閉部が形成されている包装体であって、前記密閉部において、前記表面フィルム、前記裏面フィルム、及び前記粘着剤層が、包装体の厚さ方向に、粘着剤層、表面フィルム、裏面フィルム、裏面フィルム、表面フィルム、表面フィルム、裏面フィルムの順に積層された積層構造I、及び粘着剤層、裏面フィルム、表面フィルム、表面フィルム、裏面フィルムの順に積層された積層構造IIを少なくとも有し、前記積層構造I及び前記積層構造IIが前記封止シールで覆われていることを特徴とする。【選択図】図1