SOLDER JOINT DEVICE AND SOLDER JOINT METHOD

PROBLEM TO BE SOLVED: To provide a solder joint device and a solder joint method capable of limiting the heating range to a narrower range, while avoiding thermal deformation of a board suitably.SOLUTION: A coil 16 having a shape surrounding a predetermined region R on a board 7 mounting a mounting component CP, above or below the board 7, is placed. A ferrite material 41 is placed oppositely to an object region T including an electrode 21 and the mounting component CP becoming the heating objects. Magnetic flux F generated around the coil 16 is converged efficiently through the ferrite material 41, before the object region T of the board 7 is irradiated therewith in the vertical direction. Since induction heating limited to the electrode 21, located in the range of the object region T, is carried out in the board 7, only the electrode 21 and mounting component CP becoming the object can be bonded selectively by solder.SELECTED DRAWING: Figure 2 【課題】加熱範囲をより狭い範囲に限定することを可能とし、基板が加熱変形することを好適に回避できる半田接合装置および半田接合方法を提供する。【解決手段】基板７上で実装部品ＣＰの実装された所定領域Ｒを、当該基板７の上方または下方において囲う形状のコイル１６を配置する。加熱対象となる電極２１および実装部品ＣＰを含む対象領域Ｔに対向するフェライト材４１を配置する。コイル１６の周りに発生する磁束Ｆは、効率よくフェライト材４１を伝って集束し、集束した磁束Ｆは基板７の対象領域Ｔを垂直方向に照射される。従って、基板７において対象領域Ｔの範囲内に位置する電極２１に限定した誘導加熱が行われるので、対象となる電極２１および実装部品ＣＰのみを選択的に半田で接合することができる。【選択図】図２