PRODUCTION METHOD OF LAMINATE, AND LAMINATE

PROBLEM TO BE SOLVED: To provide a production method of a laminate capable of satisfying all of smoothness of a substrate, adhesion and a lowered resistance of a conductive layer, and production easiness of the substrate.SOLUTION: A production method of a laminate includes steps for: preparing a sub...

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Hauptverfasser:	OMINE TERUAKI, NAKAGAWA MASAYUKI, EJIRI YOSHINORI, AKAI KUNIHIKO, YAMAMURA TAIZO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a production method of a laminate capable of satisfying all of smoothness of a substrate, adhesion and a lowered resistance of a conductive layer, and production easiness of the substrate.SOLUTION: A production method of a laminate includes steps for: preparing a substrate having a smooth surface with a surface roughness Ra of 0.3 μm or less; obtaining a substrate having the smooth surface with the surface roughness Ra of 0.3 μm or less and having a hydroxy group attached thereto, by bringing the substrate into contact with a solution containing a peroxide; and providing a plating layer on the smooth surface of the substrate.SELECTED DRAWING: None 【課題】基材の平滑性、導電層の密着性及び低抵抗化、並びに積層体の製造容易性をすべて満足させることができる積層体の製造方法を提供すること。【解決手段】本発明の積層体の製造方法は、表面粗さＲａが０．３μｍ以下の平滑面を有する基材を準備する工程と、基材を過酸化物が含まれる溶液と接触させて、水酸基が付与された表面粗さＲａが０．３μｍ以下の平滑面を有する基材を得る工程と、基材の平滑面にめっき層を設ける工程とを備える。【選択図】なし