ETCHING METHOD, PRODUCTION METHODS OF ARTICLE AND SEMICONDUCTOR DEVICE, AND ETCHANT

PROBLEM TO BE SOLVED: To provide an etching technique which enables an anisotropic working.SOLUTION: An etching method according to an embodiment comprises the step of bringing a semiconductor with a noble metal catalyst formed thereon into contact with an etchant 40 containing a hydrofluoric acid,...

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Bibliographische Detailangaben
1. Verfasser: ASANO YUSAKU
Format: Patent
Sprache:eng ; jpn
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