OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an optical semiconductor device that can have the sufficient wire bonding strength while the deterioration in production yield is prevented by suppressing the contamination of a substrate.SOLUTION: First ground conductors 11 and 12 are formed along a transmission line 10 on an upper surface of a substrate 5. A second ground conductor 13 is formed on a lower surface of the substrate 5 and connected to a ground electrode 6. In a central part of the substrate 5, a third ground conductor 14 is formed on a side surface of the substrate 5 and connected to the first and second ground conductors 11, 12, and 13. At an end of the substrate 5, the lower surface of the substrate 5 and a package 1 are bonded together with resin 15. At the end of the substrate 5, an outer periphery of the upper surface and the lower surface of the substrate 5 are free from the conductor.SELECTED DRAWING: Figure 5 【課題】基板の汚染を抑制して生産時の歩留り低下を防ぎ、ワイヤの十分な接合強度を得ることができる光半導体装置を得る。【解決手段】第１の接地導体１１，１２が基板５の上面において伝送線路１０に沿って形成されている。第２の接地導体１３が基板５の下面に形成され、接地電極６に接続されている。基板５の中央部において、第３の接地導体１４が基板５の側面に形成され、第１及び第２の接地導体１１，１２，１３に接続されている。基板５の端部において樹脂１５が基板５の下面をパッケージ１に接合する。基板５の端部において基板５の上面及び下面の外周部分に導体が形成されていない。【選択図】図５