SOLDER PASTE

PROBLEM TO BE SOLVED: To provide a solder paste capable of forming a solder joint having sufficient bonding strength even when used for the joining of a member to be joined containing Cu on a joining surface.SOLUTION: In a solder paste containing metallic powders: the metallic powders consist of all...

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Bibliographische Detailangaben
1. Verfasser:	TAKAMORI MASAHITO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a solder paste capable of forming a solder joint having sufficient bonding strength even when used for the joining of a member to be joined containing Cu on a joining surface.SOLUTION: In a solder paste containing metallic powders: the metallic powders consist of alloy powders containing Bi and Ag and Sn powders; the alloy powders containing Bi and Ag contain Ag in the rate of 0.1 mass% or more and 11.0 mass% or less; and the metallic powders contain Sn powders in the rate of 0.2 mass% or more and 3.0 mass% or less.SELECTED DRAWING: Figure 1 【課題】接合面にＣｕを含む被接合部材の接合に用いた場合でも、十分な接合強度のはんだ接合部を形成できるはんだペーストを提供することを目的とする。【解決手段】金属粉末を含有するはんだペーストであって、前記金属粉末が、ＢｉとＡｇとを含有する合金粉末と、Ｓｎ粉末とからなり、前記ＢｉとＡｇとを含有する合金粉末は、Ａｇを０．１質量％以上１１．０質量％以下の割合で含有し、前記金属粉末に占める前記Ｓｎ粉末の割合が、０．２質量％以上３．０質量％以下であるはんだペーストを提供する。【選択図】図１