HEAT RADIATOR PLATE

PROBLEM TO BE SOLVED: To provide a heat radiator plate superior in the contactness between an adherend such as a frame and a heat radiator plate, and voltage endurance in a transfer molding method.SOLUTION: A heat radiator plate comprises: a metal layer 11; and a resin layer 13. In the heat radiator plate, the resin layer 13 has cavities and the resin layer 13 has a porosity of 10-30%. The heat radiator plate further comprises a second resin layer 22 in addition to the resin layer 13. In the heat radiator plate, the second resin layer 22 is formed between the metal layer 11 and the resin layer 13, and substantially no cavity.SELECTED DRAWING: Figure 1 【課題】トランスファモールド成形法において、フレーム等の被着体と放熱板との密着性及び耐電圧特性に優れる放熱板を提供する。【解決手段】金属層１１と、樹脂層１３と、を含む放熱板であって、上記樹脂層１３に空隙を有し、上記樹脂層１３の空隙率が１０〜３０％である放熱板、及び前記樹脂層１３の他にさらに第２の樹脂層２２を含み、前記第２の樹脂層２２は、前記金属層１１と前記樹脂層１３との間に形成され、実質的に空隙を有さない放熱板。【選択図】図１