ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide an electronic component and a mounting structure of an electronic component that can improve mounting strength of the electronic component.SOLUTION: An electronic component C1 has a pair of end faces 2a and 2b facing each other, a pair of first side faces 2c and 2d facing each other, and a pair of second side faces 2e and 2f facing each other, and includes a rectangular parallelepiped element body 2 in which one second side face 2e serves as a mounting surface, external electrodes 5 and 7 arranged on pair of end faces 2a and 2b respectively, and an insulating layer IV covering the external electrodes 5 and 7 and the pair of side faces 2c and 2d. The thickness of an insulating layer portion ILa covering the external electrodes 5 and 7 is smaller at the end portion on one second side face 2e side than that at the central portion in the direction in which the pair of second side faces 2e and 2f face each other.SELECTED DRAWING: Figure 2 【課題】電子部品の実装強度の向上が図れる電子部品及び電子部品の実装構造を提供する。【解決手段】電子部品Ｃ１は、互いに対向する一対の端面２ａ，２ｂと、互いに対向する一対の第一側面２ｃ，２ｄと、互いに対向する一対の第二側面２ｅ，２ｆと、を有しており、一方の第二側面２ｅが実装面とされる直方体形状の素体２と、一対の端面２ａ，２ｂのそれぞれに配置されている外部電極５，７と、外部電極５，７及び一対の第一側面２ｃ，２ｄを覆っている絶縁層ＩＬと、を備え、外部電極５，７を覆う絶縁層部分ＩＬａの厚みが、一対の第二側面２ｅ，２ｆが対向している方向での中央部に比して、一方の第二側面２ｅ側の端部で小さい。【選択図】図２