METHOD FOR PRODUCING POLYIMIDE FILM

PROBLEM TO BE SOLVED: To provide a method for producing a polyimide film having a high degree of freedom of controlling of physical properties in shortening of a curing time at high temperature using an imidization catalyst.SOLUTION: There are provided a method for producing a polyimide film using a...

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Hauptverfasser: KAMIYA MIYUKI, KAKIZAKA KOTA, MORI AKIRA
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for producing a polyimide film having a high degree of freedom of controlling of physical properties in shortening of a curing time at high temperature using an imidization catalyst.SOLUTION: There are provided a method for producing a polyimide film using a nitrogen-containing heterocyclic compound having a secondary or tertiary amino group bonded directly to at least one skeleton selected from a pyridine skeleton, a quinoline skeleton, an isoquinoline skeleton, an acridine skeleton or a benzoquinoline skeleton, as an imidization catalyst, when a polyamic acid is heat treated and imidized to form at least one layer of a polyimide resin layer; and a method for producing a polyimide film, where the nitrogen-containing heterocyclic compound is represented by formula (1) or (2). In the formula (1) or (2), Ris C1-6 linear or branched alkyl group; Ris C1-6 linear or branched alkyl group; m is an integer of 1-4; n is an integer of 0-4; and Ris each independently C1-4 linear or branched alkyl group.SELECTED DRAWING: None 【課題】イミド化触媒を使用して、高温での硬化時間の短縮化において、物性制御の自由度が高いポリイミドフィルムの製造方法の提供。【解決手段】ポリアミド酸を熱処理してイミド化してポリイミド樹脂層の少なくとも1層を形成する際、ピリジン骨格、キノリン骨格、イソキノリン骨格、アクリジン骨格又はベンゾキノリン骨格より選ばれる少なくとも1種の骨格に直接結合した2級又は3級のアミノ基を有する含窒素複素環化合物をイミド化触媒を用いるポリイミドフィルムの製造方法。含窒素複素環化合物が、式(1)又は(2)で表すポリイミドフィルムの製造方法。[R1はH又はC1〜6の直鎖/分岐状のアルキル基;R2はC1−6の直鎖/分岐状のアルキル基;mは1〜4の整数;nは0〜4の整数;R3は各々独立にC1〜4の直鎖/分岐状のアルキル基]【選択図】なし