ELECTRODE STRUCTURE MANUFACTURING METHOD, SENSOR ELECTRODE MANUFACTURING METHOD, ELECTRODE STRUCTURE, AND SENSOR ELECTRODE

PROBLEM TO BE SOLVED: To provide an electrode structure manufacturing method with which it is possible to reduce the amount of noncorrosive noble metal materials used.SOLUTION: Provided is an electrode structure manufacturing method for manufacturing an electrode structure having a substrate 1 havin...

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Bibliographische Detailangaben
Hauptverfasser: HIGUCHI TAKUYA, INOUE HISAMI, SUENAGA TOMOKAZU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electrode structure manufacturing method with which it is possible to reduce the amount of noncorrosive noble metal materials used.SOLUTION: Provided is an electrode structure manufacturing method for manufacturing an electrode structure having a substrate 1 having insulation properties and an electrode layer 3 having an electrode part formed on one surface of the substrate by a noncorrosive noble metal material and including a comb-shaped electrode 14 formed in shape of a comb, said method including a ground layer formation step of forming a plating ground layer that includes a catalyst nucleus for electroless plating and a binder resin on one surface of the substrate in shape of the same pattern as the pattern shape of an electrode layer, and an electroless plating step of forming the electrode layer on the surface of the plating ground layer by an electroless plating method.SELECTED DRAWING: Figure 1 【課題】非腐食性の貴金属材料の使用量を低減可能な電極構造の製造方法を提供する。【解決手段】絶縁性を有する基材1と、基材の一方の表面に非腐食性の貴金属材料により形成され、櫛形形状の櫛形電極14を含む電極部を有する電極層3と、を有する電極構造を製造するための電極構造の製造方法であって、基材の一方の表面に、無電解めっき用触媒核およびバインダ樹脂を含むめっき下地層を、電極層のパターン形状と同一のパターン形状に形成するめっき下地層形成工程と、めっき下地層の表面に、無電解めっき法により上記電極層を形成する無電解めっき工程と、を有する。【選択図】図1