ADHESIVE-FITTED POLYIMIDE FILM

PROBLEM TO BE SOLVED: To provide a base material for a flat cable useful, e.g., for the production of a flat cable.SOLUTION: An adhesive-fitted polyimide film having a polyimide film whose thermal shrinkage after heating at 200°C for 60 min is 0.2% or lower and an adhesive layer, and in which the ne...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	UCHIYAMA MAI, OKUI MASAKAZU, HIDAKA SHOTARO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	UCHIYAMA MAI OKUI MASAKAZU HIDAKA SHOTARO
description	PROBLEM TO BE SOLVED: To provide a base material for a flat cable useful, e.g., for the production of a flat cable.SOLUTION: An adhesive-fitted polyimide film having a polyimide film whose thermal shrinkage after heating at 200°C for 60 min is 0.2% or lower and an adhesive layer, and in which the needle penetration amount at 180°C in TMA needle penetration mode measurement of the adhesive layer is 40% or higher the thickness of the adhesive layer is used as a base material for a flat cable.SELECTED DRAWING: None 【課題】本発明は、フラットケーブルの製造等に有用なフラットケーブル用基材を提供することにある。【解決手段】２００℃で６０分加熱後の熱収縮率が０．２％以下のポリイミドフィルムと接着剤層を有し、接着剤層のＴＭＡ針入りモード測定の１８０℃に於ける針入り侵入量が接着剤層の厚さの４０％以上である接着剤付きポリイミドフィルムを、フラットケーブル用基材として使用する。【選択図】なし
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2017137418A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2017137418A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2017137418A3</originalsourceid><addsrcrecordid>eNrjZJBzdPFwDfYMc9V18wwJcXVRCPD3ifT09XRxVXDz9PHlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBobmhsbmJoYWjsZEKQIA8pwhxw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ADHESIVE-FITTED POLYIMIDE FILM</title><source>esp@cenet</source><creator>UCHIYAMA MAI ; OKUI MASAKAZU ; HIDAKA SHOTARO</creator><creatorcontrib>UCHIYAMA MAI ; OKUI MASAKAZU ; HIDAKA SHOTARO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a base material for a flat cable useful, e.g., for the production of a flat cable.SOLUTION: An adhesive-fitted polyimide film having a polyimide film whose thermal shrinkage after heating at 200°C for 60 min is 0.2% or lower and an adhesive layer, and in which the needle penetration amount at 180°C in TMA needle penetration mode measurement of the adhesive layer is 40% or higher the thickness of the adhesive layer is used as a base material for a flat cable.SELECTED DRAWING: None 【課題】本発明は、フラットケーブルの製造等に有用なフラットケーブル用基材を提供することにある。【解決手段】２００℃で６０分加熱後の熱収縮率が０．２％以下のポリイミドフィルムと接着剤層を有し、接着剤層のＴＭＡ針入りモード測定の１８０℃に於ける針入り侵入量が接着剤層の厚さの４０％以上である接着剤付きポリイミドフィルムを、フラットケーブル用基材として使用する。【選択図】なし</description><language>eng ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; CONDUCTORS ; DYES ; ELECTRICITY ; INSULATORS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170810&DB=EPODOC&CC=JP&NR=2017137418A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170810&DB=EPODOC&CC=JP&NR=2017137418A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UCHIYAMA MAI</creatorcontrib><creatorcontrib>OKUI MASAKAZU</creatorcontrib><creatorcontrib>HIDAKA SHOTARO</creatorcontrib><title>ADHESIVE-FITTED POLYIMIDE FILM</title><description>PROBLEM TO BE SOLVED: To provide a base material for a flat cable useful, e.g., for the production of a flat cable.SOLUTION: An adhesive-fitted polyimide film having a polyimide film whose thermal shrinkage after heating at 200°C for 60 min is 0.2% or lower and an adhesive layer, and in which the needle penetration amount at 180°C in TMA needle penetration mode measurement of the adhesive layer is 40% or higher the thickness of the adhesive layer is used as a base material for a flat cable.SELECTED DRAWING: None 【課題】本発明は、フラットケーブルの製造等に有用なフラットケーブル用基材を提供することにある。【解決手段】２００℃で６０分加熱後の熱収縮率が０．２％以下のポリイミドフィルムと接着剤層を有し、接着剤層のＴＭＡ針入りモード測定の１８０℃に於ける針入り侵入量が接着剤層の厚さの４０％以上である接着剤付きポリイミドフィルムを、フラットケーブル用基材として使用する。【選択図】なし</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBzdPFwDfYMc9V18wwJcXVRCPD3ifT09XRxVXDz9PHlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBobmhsbmJoYWjsZEKQIA8pwhxw</recordid><startdate>20170810</startdate><enddate>20170810</enddate><creator>UCHIYAMA MAI</creator><creator>OKUI MASAKAZU</creator><creator>HIDAKA SHOTARO</creator><scope>EVB</scope></search><sort><creationdate>20170810</creationdate><title>ADHESIVE-FITTED POLYIMIDE FILM</title><author>UCHIYAMA MAI ; OKUI MASAKAZU ; HIDAKA SHOTARO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017137418A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>UCHIYAMA MAI</creatorcontrib><creatorcontrib>OKUI MASAKAZU</creatorcontrib><creatorcontrib>HIDAKA SHOTARO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UCHIYAMA MAI</au><au>OKUI MASAKAZU</au><au>HIDAKA SHOTARO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE-FITTED POLYIMIDE FILM</title><date>2017-08-10</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To provide a base material for a flat cable useful, e.g., for the production of a flat cable.SOLUTION: An adhesive-fitted polyimide film having a polyimide film whose thermal shrinkage after heating at 200°C for 60 min is 0.2% or lower and an adhesive layer, and in which the needle penetration amount at 180°C in TMA needle penetration mode measurement of the adhesive layer is 40% or higher the thickness of the adhesive layer is used as a base material for a flat cable.SELECTED DRAWING: None 【課題】本発明は、フラットケーブルの製造等に有用なフラットケーブル用基材を提供することにある。【解決手段】２００℃で６０分加熱後の熱収縮率が０．２％以下のポリイミドフィルムと接着剤層を有し、接着剤層のＴＭＡ針入りモード測定の１８０℃に於ける針入り侵入量が接着剤層の厚さの４０％以上である接着剤付きポリイミドフィルムを、フラットケーブル用基材として使用する。【選択図】なし</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; jpn
recordid	cdi_epo_espacenet_JP2017137418A
source	esp@cenet
subjects	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS AS ADHESIVES
title	ADHESIVE-FITTED POLYIMIDE FILM
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T11%3A55%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=UCHIYAMA%20MAI&rft.date=2017-08-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2017137418A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true