ADHESIVE-FITTED POLYIMIDE FILM

PROBLEM TO BE SOLVED: To provide a base material for a flat cable useful, e.g., for the production of a flat cable.SOLUTION: An adhesive-fitted polyimide film having a polyimide film whose thermal shrinkage after heating at 200°C for 60 min is 0.2% or lower and an adhesive layer, and in which the ne...

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Bibliographische Detailangaben
Hauptverfasser:	UCHIYAMA MAI, OKUI MASAKAZU, HIDAKA SHOTARO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a base material for a flat cable useful, e.g., for the production of a flat cable.SOLUTION: An adhesive-fitted polyimide film having a polyimide film whose thermal shrinkage after heating at 200°C for 60 min is 0.2% or lower and an adhesive layer, and in which the needle penetration amount at 180°C in TMA needle penetration mode measurement of the adhesive layer is 40% or higher the thickness of the adhesive layer is used as a base material for a flat cable.SELECTED DRAWING: None 【課題】本発明は、フラットケーブルの製造等に有用なフラットケーブル用基材を提供することにある。【解決手段】２００℃で６０分加熱後の熱収縮率が０．２％以下のポリイミドフィルムと接着剤層を有し、接着剤層のＴＭＡ針入りモード測定の１８０℃に於ける針入り侵入量が接着剤層の厚さの４０％以上である接着剤付きポリイミドフィルムを、フラットケーブル用基材として使用する。【選択図】なし