RESIN COMPOSITION FOR SEMICONDUCTOR BONDING AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor bonding which has a low elastic modulus and excellent adhesiveness and has good curability even in the atmosphere, and a semiconductor device having excellent solder reflow resistance.SOLUTION: The resin composition for semicondu...

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Hauptverfasser:	OSHIMA AYA, TANO MASARU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor bonding which has a low elastic modulus and excellent adhesiveness and has good curability even in the atmosphere, and a semiconductor device having excellent solder reflow resistance.SOLUTION: The resin composition for semiconductor bonding contains (A) a bismaleimide resin represented by general formula (1), (B) an allylated bisphenol type epoxy resin, (C) a curing agent, and (D) a filler. The mass ratio (A)/(B) of the component (A) to the component (B) is 50/50-95/5. The semiconductor device is obtained by bonding a semiconductor element onto a support member with such a composition. (In the formula, X represents a 1-100C divalent aliphatic hydrocarbon group.)SELECTED DRAWING: None 【課題】低弾性率で接着性に優れ、かつ大気中においても硬化性が良好な半導体接着用樹脂組成物、及び耐半田リフロー性に優れる半導体装置を提供する。【解決手段】半導体接着用樹脂組成物は、（Ａ）一般式（１）で表されるビスマレイミド樹脂、（Ｂ）アリル化ビスフェノール型エポキシ樹脂、（Ｃ）硬化剤、及び（Ｄ）充填剤を含有し、前記（Ａ）成分と前記（Ｂ）成分との質量比（Ａ）／（Ｂ）が５０／５０〜９５／５である。半導体装置は、そのような組成物により半導体素子を支持部材上に接着してなる。【化１】（式中、Ｘは、炭素数が１〜１００の２価の脂肪族炭化水素基を示す。）【選択図】なし