STRUCTURE STAMP, APPARATUS AND METHOD FOR EMBOSSING PROCESSING

PROBLEM TO BE SOLVED: To provide a micro-patterning and/or nano-patterning apparatus and method capable of granting automated and prompter process execution.SOLUTION: A structure stamp 5 comprises: a flexible stamp 1 including a micro-patterned or nano-patterned stamp face; and a frame 3 over which...

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Bibliographische Detailangaben
Hauptverfasser:	GERALD KREINDL, JAKOB HARMING, CHRISTINE THANNER, SCHON CHRISTIAN, VISCHER PETER
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a micro-patterning and/or nano-patterning apparatus and method capable of granting automated and prompter process execution.SOLUTION: A structure stamp 5 comprises: a flexible stamp 1 including a micro-patterned or nano-patterned stamp face; and a frame 3 over which the stamp is tensed. An apparatus for performing embossing processing of an emboss pattern on an emboss face comprises: a stamp housing part in which the structure stamp is housed and moved; an embossing material housing part in which an embossing material 6 is housed and disposed oppositely to the structure stamp; and an embossing element drive device which moves an embossing element 8 along the structure stamp.SELECTED DRAWING: Figure 3 【課題】自動化および一層迅速なプロセス実行を保証することのできるようなマイクロパターン化および／またはナノパターン化のための装置および方法を提供する。【解決手段】構造体スタンプ５がマイクロパターン化またはナノパターン化されたスタンプ面を有するフレキシブルなスタンプ１と、該スタンプを張設するフレーム３とを備え、型押し面に型押しパターンを型押し加工する装置が構造体スタンプを収容しかつ運動させるスタンプ収容部と、構造体スタンプに対向して型押し材料６を収容しかつ配置する型押し材料収容部と、型押しエレメント８を構造体スタンプに沿って運動させる型押しエレメント駆動装置とを備えている。【選択図】図３