LEAD FRAME, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a lead frame hardly deformed even when reduced in thickness.SOLUTION: The present lead frame includes a first lead comprising a first lead frame and a second lead comprising a second lead frame which are joined to each other. A resin part is disposed between the firs...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUZAWA HIDEKI, KASAHARA TETSUICHIRO, OGUSHI MASAYUKI, SAKAI NAOYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a lead frame hardly deformed even when reduced in thickness.SOLUTION: The present lead frame includes a first lead comprising a first lead frame and a second lead comprising a second lead frame which are joined to each other. A resin part is disposed between the first lead and the second lead. Each of the first lead and the second lead includes a buried part buried in the resin part and a projecting part projecting from the resin part. The buried part of the first lead and the buried part of the second lead are joined in the resin part.SELECTED DRAWING: Figure 2 【課題】薄型化しても変形し難いリードフレームを提供する。【解決手段】本リードフレームは、第１リードフレームからなる第１リードと、第２リードフレームからなる第２リードと、を接合してなるリードフレームであって、前記第１リードと前記第２リードとの間に樹脂部が配置され、前記第１リードと前記第２リードとは、前記樹脂部に埋設された埋設部と、前記樹脂部から突出する突出部と、を備え、前記第１リードの埋設部と前記第２リードの埋設部とは、前記樹脂部内で接合されている。【選択図】図２