HIGH-DENSITY INTEGRATED CIRCUIT PACKAGE STRUCTURE AND INTEGRATED CIRCUIT

PROBLEM TO BE SOLVED: To provide a high-density integrated circuit package structure and an integrated circuit.SOLUTION: A high-density integrated circuit package structure includes a rectangular parallelepiped plastic package structure in which a metal lead frame, a chip, and a micron connection wi...

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Bibliographische Detailangaben

1. Verfasser:	LIANG DAZHONG
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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