ELECTRONIC COMPONENT MOUNTER
PROBLEM TO BE SOLVED: To provide an electronic component mounter capable of precisely recognizing a cavity at a component supplying position.SOLUTION: An electronic component mounter 9 includes: a tape feeder 1 feeding a carrier tape 8 to a component supplying position 15, the carrier tape being pro...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an electronic component mounter capable of precisely recognizing a cavity at a component supplying position.SOLUTION: An electronic component mounter 9 includes: a tape feeder 1 feeding a carrier tape 8 to a component supplying position 15, the carrier tape being provided, at a certain interval, with a plurality of sprocket holes 832, 841 and a plurality of cavities 831 for receiving a plurality of components; a substrate camera 946 (imaging device) for imaging images at a plurality of predetermined positions in the carrier tape 8 fed by the tape feeder 1; and a component transfer device 94 correcting the component supplying position 15 on the basis of images at the plurality of predetermined positions and picking a component P received in the cavity 831 at the corrected component supplying position 15 to mount the component P on a substrate K that is positioned on a component mounting position.SELECTED DRAWING: Figure 6
【課題】部品供給位置にあるキャビティを正確に認識できる電子部品装着機を提供する。【解決手段】電子部品装着機9は、一定の間隔に複数の送り穴832,841と複数の部品収納用のキャビティ831を設けたキャリアテープ8を部品供給位置15に搬送するテープフィーダ1と、テープフィーダ1にて搬送されるキャリアテープ8における複数の所定位置の画像を撮像する基板カメラ946(撮像装置)と、複数の所定位置の画像に基づいて部品供給位置15を補正し、補正された部品供給位置15でキャビティ831に収納された部品Pを採取して、部品装着位置に位置決めされる基板K上に部品Pを装着する部品移載装置94と、を備える。【選択図】図6 |
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