REMOTE CONTROLLER

PROBLEM TO BE SOLVED: To provide a remote controller capable of suppressing a decrease in microphone sensitivity.SOLUTION: A case 20 has: a board accommodation part 35 where a circuit board 65 is accommodated, a microphone holding part 36 where a microphone 67 is held inside, and a first sound colle...

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Bibliographische Detailangaben
Hauptverfasser: FUKUSHIMA YOSHIHIKO, YOKOTA TADAYUKI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a remote controller capable of suppressing a decrease in microphone sensitivity.SOLUTION: A case 20 has: a board accommodation part 35 where a circuit board 65 is accommodated, a microphone holding part 36 where a microphone 67 is held inside, and a first sound collection hole 37 located nearby the microphone 67. A lead wire 69 has one end connected to the microphone 67 and the other end connected to the circuit board 65. The circuit board 65 comprises a board-side connector part 71 to which the other end of the lead wire 69 is connected on a surface 65a, and also comprises a lead wire insertion hole 65c penetrating the circuit board 65 in a thickness direction between a board-side connector part 71 and the microphone 67. A lead wire extraction position P on an outer surface of the microphone 67 is located where a height from a bottom part of the board accommodation part 35 is higher than a reverse-side opening part 65d of the lead wire insertion hole 65c. The lead wire 69 extends from the microphone 67 to the board-side connector part 71 by passing through between the circuit board 65 and the bottom part of the board accommodation part 35 and then penetrating the lead wire insertion hole 65c.SELECTED DRAWING: Figure 4 【課題】マイク感度の低下を抑制することができるリモコンを提供する。【解決手段】ケース20は、回路基板65を収容した基板収容部35、マイク67を内側に保持したマイク保持部36、及びマイク67の近傍に位置する第1の集音孔37を有する。リード線69は、一端がマイク67に他端が回路基板65に接続されている。回路基板65は、表面65aにリード線69の他端が接続された基板側コネクタ部71を備えるとともに、基板側コネクタ部71とマイク67との間に回路基板65を厚さ方向に貫通したリード線挿通孔65cを備えている。マイク67の外表面におけるリード線取出し位置Pは、基板収容部35の底部からの高さが、リード線挿通孔65cの裏面側開口部65dよりも高い位置に位置する。リード線69は、マイク67から回路基板65と基板収容部35の底部との間を通り、リード線挿通孔65cを貫通して基板側コネクタ部71まで延びている。【選択図】図4