METAL POWDER, METHOD FOR PRODUCING LAMINATED MOLDING AND LAMINATED MOLDING

PROBLEM TO BE SOLVED: To provide a metal powder for lamination molding that comprises a copper alloy and achieves both mechanical strength and conductivity.SOLUTION: A metal powder is used for lamination molding and comprises aluminum of 0.2 mass% or more and 1.3 mass% or less with the balance being...

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Bibliographische Detailangaben
Hauptverfasser:	OKA YOHEI, OKUBO HIROAKI, MARUYAMA TSUYOSHI, TSUBOTA RYUSUKE, TANAKA JUNICHI, NISHIZAWA YOSHITO, NISHIDA MOTONORI, OKAMOTO HIROSHI, KIKUKAWA SHINRI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ALLOYS CASTING CHEMISTRY FERROUS OR NON-FERROUS ALLOYS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a metal powder for lamination molding that comprises a copper alloy and achieves both mechanical strength and conductivity.SOLUTION: A metal powder is used for lamination molding and comprises aluminum of 0.2 mass% or more and 1.3 mass% or less with the balance being copper and unavoidable impurities.SELECTED DRAWING: None 【課題】銅合金から構成され、機械強度および導電率を両立できる積層造形用の金属粉末を提供する。【解決手段】金属粉末は、積層造形用の金属粉末であり、アルミニウムを０．２質量％以上１．３質量％以下含有し、残部が銅および不可避不純物からなる。【選択図】なし