PHENOXY RESIN

PROBLEM TO BE SOLVED: To provide a phenoxy resin having excellent heat resistance and excellent solubility in a general-purpose organic solvent.SOLUTION: The present invention provides a phenoxy resin comprising structural units represented by formula (1) and formula (2) [R-Rindependently represent...

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Bibliographische Detailangaben
Hauptverfasser:	MASUDA KATSUYUKI, OKOSHI SHOJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a phenoxy resin having excellent heat resistance and excellent solubility in a general-purpose organic solvent.SOLUTION: The present invention provides a phenoxy resin comprising structural units represented by formula (1) and formula (2) [R-Rindependently represent H, a C1-10 alkyl group, a C3-10 cycloalkyl group, a C6-18 aryl group or a halogen atom, and * is a bond].SELECTED DRAWING: None 【課題】耐熱性、汎用有機溶剤への溶解性に優れるフェノキシ樹脂を提供する。【解決手段】式（１）及び式（２）で示される構造単位からなるフェノキシ樹脂。［Ｒ１〜Ｒ１６は夫々独立にＨ、Ｃ１〜１０のアルキル基、Ｃ３〜１０のシクロアルキル基、Ｃ６〜１８のアリール基又はハロゲン原子、＊は結合手］【選択図】なし