HOLDING MEMBER FOR BREAKING

PROBLEM TO BE SOLVED: To break without any positional deviation in breaking a substrate that is a brittle material substrate, such as a semiconductor wafer, and has a functional region (device region).SOLUTION: A holding member for breaking that breaks a brittle material substrate having a scribe li...

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Bibliographische Detailangaben
Hauptverfasser:	MURAKAMI KENJI, IWATSUBO YUMA, TAKEDA MASAKAZU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Zusammenfassung:	PROBLEM TO BE SOLVED: To break without any positional deviation in breaking a substrate that is a brittle material substrate, such as a semiconductor wafer, and has a functional region (device region).SOLUTION: A holding member for breaking that breaks a brittle material substrate having a scribe line includes: a center opening that is smaller than the brittle material substrate; and a comb-like part constituted of a projection part oriented from the periphery toward the center opening and having a pitch equivalent to a pitch of the functional region of the brittle material substrate, and slits.SELECTED DRAWING: Figure 3A 【課題】半導体ウエハ等の脆性材料基板であって、機能領域（デバイス領域）を有する基板をブレイクする際に位置ずれなくブレイクできるようにすること。【解決手段】スクライブラインを有する脆性材料基板をブレイクするブレイク用押さえ部材であって、前記脆性材料基板より小さい中央の開口と、周囲より前記中央の開口に向けて、前記脆性材料基板の機能領域のピッチに相当するピッチの突起部及びスリットから成るくし状部と、を有するブレイク用押さえ部材。【選択図】図３Ａ