COVERED OPTICAL SEMICONDUCTOR ELEMENT PRODUCTION METHOD

PROBLEM TO BE SOLVED: To provide a covered optical semiconductor element production method, by which a covered optical semiconductor element can be reliably separated from a temporary fixing sheet.SOLUTION: A method for producing a covered optical semiconductor element 5 comprises: a step (1) of preparing a plurality of optical semiconductor elements 1 that are temporarily fixed on an upper surface of a first temporary fixing sheet 10 so as to be separated from each other and a first phosphor layer 2 that covers the plurality of optical semiconductor elements 1 in such a manner that the first phosphor layer 2 is in direct contact with parts of the upper surface of the first temporary fixing sheet 10, provided that the parts are exposed from the plurality of optical semiconductor elements 1; a step (2) of forming a groove 3 in a part of the first phosphor layer 2 positioned between every adjacent optical semiconductor elements 1, provided that the groove 3 is opened at the top; a step (3) of filling at least the groove 3 with a second covering layer 4, thereby obtaining a covered optical semiconductor element 1 that is provided with the optical semiconductor elements 1, the first phosphor layer 2 and the second covering layer 4; and a step (4) of separating the covered optical semiconductor element 1 from the first temporary fixing sheet 10. In the step (3), the first phosphor layer 2 intervenes between the first temporary fixing sheet 10 and the second covering layer 4 filled in the groove 3.SELECTED DRAWING: Figure 1 【課題】被覆光半導体素子を仮固定シートから確実に剥離することのできる、被覆光半導体素子の製造方法を提供すること。【解決手段】被覆光半導体素子５の製造方法は、第１仮固定シート１０の上面に互いに間隔を隔てて仮固定された複数の光半導体素子１と、複数の光半導体素子１から露出する第１仮固定シート１０の上面に直接接触するように、複数の光半導体素子１を被覆する第１蛍光体層２とを用意する工程（１）と、隣接する光半導体素子１の間に位置する第１蛍光体層２に、上方に向かって開放される溝３を設ける工程（２）と、第２被覆層４を少なくとも溝３に充填して、光半導体素子１、第１蛍光体層２および第２被覆層４を備える被覆光半導体素子１を得る工程（３）と、被覆光半導体素子１を第１仮固定シート１０から剥離する工程（４）とを備える。工程（３）では、第１蛍光体層２が、溝３に充填された第２被覆層４と、第１仮固定シート１０との間に介在している。【選択図】図１