METHOD OF FORMING METAL LAYER

PROBLEM TO BE SOLVED: To provide a convenient method that forms a metal member (metal layer) on ceramic base material with high adhesion force.SOLUTION: The present invention provides a method of forming a metal layer on ceramic base material, the method including the steps of irradiating the surfac...

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Bibliographische Detailangaben
Hauptverfasser:	SUMINO KOHEI, KUNISHI TATSUO, YOSHIDA IKUSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a convenient method that forms a metal member (metal layer) on ceramic base material with high adhesion force.SOLUTION: The present invention provides a method of forming a metal layer on ceramic base material, the method including the steps of irradiating the surface of a ceramic base material comprising metal atoms with high intensity light to precipitate metal particles on the surface of the ceramic base material, and then forming a metal layer on the precipitated metal particles through plating treatment.SELECTED DRAWING: Figure 1 【課題】セラミック基材上に、高い密着力で、金属部材（金属層）を形成する簡便な方法の提供。【解決手段】セラミック基材上に金属層を形成する方法であって、金属原子を含むセラミック基材の表面に高強度光を照射することにより、セラミック基材の表面上に金属粒子を析出させること、次いで、めっき処理により、析出した金属粒子上に金属層を形成することを含む方法。【選択図】図１