METHOD OF DIRECTLY BONDING TWO ELEMENTS CONTAINING COPPER PART AND DIELECTRIC MATERIAL PART

PROBLEM TO BE SOLVED: To provide a novel method for assembling two elements by direct bonding between two surfaces including both a copper part and a part made of a dielectric material.SOLUTION: An assembling method of a first element I and a second element II, having a surface including copper part...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PIERRIC GUEGUEN, LEACIOCCIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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