METHOD OF DIRECTLY BONDING TWO ELEMENTS CONTAINING COPPER PART AND DIELECTRIC MATERIAL PART

PROBLEM TO BE SOLVED: To provide a novel method for assembling two elements by direct bonding between two surfaces including both a copper part and a part made of a dielectric material.SOLUTION: An assembling method of a first element I and a second element II, having a surface including copper parts 6, 106 separated by dielectric materials 4, 104, by direct bonding includes a step of polishing the surface, a step of forming diffusion barriers 10, 110 selectively in the copper parts 6, 106 of the first and second elements, and a step of bringing two surfaces into contact, so that the copper parts 6, 106 of one surface cover the copper parts 6, 106 of the other surface at least partially, and direct bonding can be obtained between the surfaces.SELECTED DRAWING: Figure 1D 【課題】銅部分及び誘電材料から作られる部分の両方を含む２つの表面間において直接ボンディングによって２つの要素を組み立てる新規な方法を提供する。【解決手段】組立方法は、誘電材料４、１０４によって分離された銅部分６、１０６を備える表面を有する第１の要素Ｉ及び第２の要素ＩＩの直接ボンディングによる組立方法であって、表面を研磨する段階と、第１及び第２の要素の銅部分６、１０６に選択的に拡散障壁１０、１１０を形成する段階と、２つの表面を接触させる段階であって、一方の表面の銅部分６、１０６が他の表面の銅部分１０６、６を少なくとも部分的に覆い、直接ボンディングが表面間に得られるような段階と、を含む。【選択図】図１Ｄ