INTERMEDIATE LAYER FORMED BETWEEN SUBSTRATE AND DLC LAYER, AND ITS FILM DEPOSITION METHOD
PROBLEM TO BE SOLVED: To satisfy a desire to suppress a peel at an interface between an intermediate layer and the DLC layer at the high load slide time thereby to improve the anti-seizure of the DLC film coated member, because a DLC film coated member of the prior art is feared to peel the interfac...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To satisfy a desire to suppress a peel at an interface between an intermediate layer and the DLC layer at the high load slide time thereby to improve the anti-seizure of the DLC film coated member, because a DLC film coated member of the prior art is feared to peel the interface between an intermediate layer and a DLC layer at the high load slide time.SOLUTION: In an intermediate layer 4 to be formed between a substrate 2 and a DLC layer 5, there are formed a Ti layer 4a and a TiC layer 4b to be formed on the surface of said Ti layer 4a, the carbon content of the layer entirety containing said Ti layer and said TiC layer is from 53 at% to 77 at%.SELECTED DRAWING: Figure 1
【課題】従来のDLC膜被覆部材は、高負荷摺動時において中間層とDLC層の界面が剥離し、焼き付きが生じるおそれがあった。このため、高負荷摺動時における中間層とDLC層との界面における剥離を抑制し、DLC膜被覆部材の耐焼き付き性を向上させることが望まれていた。【解決手段】基材2とDLC層5との間に形成される中間層4において、Ti層4aと、前記Ti層4aの表面に形成されるTiC層4bとを設け、前記Ti層および前記TiC層を含む層全体の炭素含有量を53at%以上、77at%以下とする。【選択図】図1 |
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