LED ELEMENT PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND LED LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide an LED element packaging substrate and a method of manufacturing the same, and an LED light-emitting device and a method of manufacturing the same, capable of securing a wide area of a reflection metal layer for reflecting light from an LED element, and of enhancing reflection efficiency of the light from the LED element.SOLUTION: An LED element packaging substrate 10 comprises: an insulating layer 11; a plurality of first conductive layers 12 formed on a surface of the insulating layer 11, and arranged so as to be separated from each other via a space S; and reflection metal layers 14 that respectively cover surfaces of the first conductive layers 12. Through-holes 11a are respectively formed at positions corresponding to the respective first conductive layers 12, on the insulating layer 11. At least a part of each through-hole 11a is filled with an interlayer connection part 17. Each interlayer connection part 17 is covered with the reflection metal layer 14.SELECTED DRAWING: Figure 2 【課題】ＬＥＤ素子からの光を反射する反射金属層の面積を広く確保し、ＬＥＤ素子からの光の反射効率を高めることが可能な、ＬＥＤ素子実装用基板およびその製造方法、ならびにＬＥＤ発光装置およびその製造方法を提供する。【解決手段】ＬＥＤ素子実装用基板１０は、絶縁層１１と、絶縁層１１の表面に形成され、空間Ｓを介して互いに離間して配置された複数の第１導電層１２と、各第１導電層１２の表面をそれぞれ覆う反射金属層１４とを備えている。絶縁層１１のうち、各第１導電層１２に対応する位置にそれぞれ貫通孔１１ａが形成されている。各貫通孔１１ａの少なくとも一部に層間接続部１７が充填され、各層間接続部１７は、反射金属層１４によって覆われている。【選択図】図２