SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of outputting a large current with a high level of safety.SOLUTION: A semiconductor device according to an embodiment includes: a first conductor; a semiconductor chip one surface of which has a first electrode and the other surface of...

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Bibliographische Detailangaben
Hauptverfasser: MATSUMURA HITOTSUGU, KOTANI KAZUYA, ICHIKURA YUTA, IIO HISATAKA, TAKENAKA HIROSHI, TSUNEOKA OSAMU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device capable of outputting a large current with a high level of safety.SOLUTION: A semiconductor device according to an embodiment includes: a first conductor; a semiconductor chip one surface of which has a first electrode and the other surface of which has a second electrode; a conductive first joint material that is provided between the first conductor and first electrode; a second conductor that includes a first part having a first surface and a second part having a second surface which is provided between the first part and semiconductor chip and whose area is narrower than the area of the first surface; a conductive second joint material that is provided between the second electrode and second surface; and a resin member that is provided so as to cover at least a peripheral edge part of the semiconductor chip.SELECTED DRAWING: Figure 2 【課題】安全性が高い大電流出力が可能な半導体装置を提供する。【解決手段】実施形態に係る半導体装置は、第1導体と、一方の面に第1電極を有し、他方の面に第2電極を有する半導体チップと、前記第1導体と前記第1電極との間に設けられた導電性の第1接合材と、第1面を有する第1部分と、前記第1部分と半導体チップとの間に設けられ前記第1面の面積よりも狭い面積の第2面を有する第2部分と、を有する第2導体と、前記第2電極と前記第2面との間に設けられた導電性の第2接合材と、前記半導体チップの少なくとも周縁部を覆うように設けられた樹脂部材と、を備える。【選択図】図2