POWER CONVERSION DEVICE
PROBLEM TO BE SOLVED: To provide a technique as a power conversion device which directly fits the housing of a power conditioner to an outer wall of a house, and can prevent infiltration of rainwater into the housing and form an aggressive air flow for effectively exercising a heat radiation action...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a technique as a power conversion device which directly fits the housing of a power conditioner to an outer wall of a house, and can prevent infiltration of rainwater into the housing and form an aggressive air flow for effectively exercising a heat radiation action on heating portions of various kinds of electrical components equipped in the housing to thereby effectively cool the heating portions.SOLUTION: A first air duct 8 and a second air duct 9 each of which is vertically elongated and provided with a fan 10, 11 and has an air entrance at the upper end thereof and an air exit at the lower end thereof is arranged in the housing. Heat radiating fins of a heat sink 7 having a heat generating semiconductor element fitted to a substrate portion are arranged in the first air duct. Heat generating electric components other than semiconductor element are arranged in the second air duct. There is formed such a stream of outside air that the outside air is sucked from an air flow-in port formed at an intermediate between the right and lower walls of the housing or the lower portion of the housing, and passed through the first air duct and the second air duct, and then flows out of an air discharge port of the lower wall of the housing.SELECTED DRAWING: Figure 5
【課題】パワーコンディショナの筐体を家屋の外壁に直接取り付ける電力変換装置として、筺体内部への雨水の侵入を防止し、且つ、その筺体内部に備えた各種電気部品の発熱部分の放熱作用を効果的に発揮するための積極的な空気の流れを形成し、効果的に冷却させることができる技術を提供する。【解決手段】それぞれファン10,11を備え上端を空気入り口とし下端を空気出口とする上下方向の第1空気ダクト8と第2空気ダクト9を筺体内に配置し、発熱性の半導体素子を基板部に取り付けたヒートシンク7の放熱フィンを第1空気ダクト内に配置し、半導体素子以外の発熱性の電気部品を第2空気ダクト内に配置し、外気を筺体の左右壁の中間部または下部に形成した空気流入口から吸い込み、第1空気ダクトと第2空気ダクトを通り筺体の下壁の空気排出口から流出する流れを形成。【選択図】図5 |
---|