LED ELEMENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME AND LED LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide an LED element mounting substrate which secures a wide area of a reflection metal layer for reflecting light from the LED element to improve the efficiency of reflection of the light from the LED element and a manufacturing method of the LED element mounting substrate, and to provide an LED light emitting device and a manufacturing method of the LED light emitting device.SOLUTION: An LED element mounting substrate 10 includes: an insulation layer 11; first conductive layers 12 which are formed on a surface of the insulation layer 11 and disposed spaced away from each other through spaces S; and reflective metal layers 14 respectively covering surfaces of the first conductive layers 12. At least one part of a side surface 12a of each first conductive layer 12 is not covered by the reflective metal layer 14.SELECTED DRAWING: Figure 1 【課題】ＬＥＤ素子からの光を反射する反射金属層の面積を広く確保し、ＬＥＤ素子からの光の反射効率を高めることが可能な、ＬＥＤ素子実装用基板およびその製造方法、ならびにＬＥＤ発光装置およびその製造方法を提供する。【解決手段】ＬＥＤ素子実装用基板１０は、絶縁層１１と、絶縁層１１の表面に形成され、空間Ｓを介して互いに離間して配置された複数の第１導電層１２と、各第１導電層１２の表面をそれぞれ覆う反射金属層１４とを備えている。各第１導電層１２の側面１２ａのうち少なくとも一部の側面１２ａは、反射金属層１４によって覆われていない。【選択図】図１