WINDING STRUCTURE OF BONDING WIRE FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a novel bonding wire winding structure which makes a fastening force stronger than the prior arts and prevents collapse even under vibrations or the like during transportation, and to provide a bonding wire winding structure which prevents a wire from being wasted and is capable of smoothly performing exchange work of a spool.SOLUTION: In a winding structure of a bonding wire that is wound on a spool consisting of a lead winding portion of an alignment roll, a main winding portion of a cross multilayer roll and a tail winding portion of the alignment roll, a projection of an intermediate or upper hypotenuse having an elevation angle steeper than an elevation angle of a lower hypotenuse extending from a spool end is formed on at least one hypotenuse formed from both end shapes of the main winding portion. A wavelet zigzag layer is continued to the projection, and an apex of the upper hypotenuse is made higher than an average height of the zigzag layer.SELECTED DRAWING: Figure 2 【課題】従来よりも締めつけ力が強く、かつ、輸送時の振動等にもに崩れしない新規なボンディングワイヤの巻線構造を提供する。また、ワイヤの無駄をなくし、スプールの交換作業をスムーズに行うことができるボンディングワイヤの巻線構造を提供する。【解決手段】整列巻のリード巻き部分とクロス多層巻きの本巻き部分と整列巻きのテール巻き部分とからなるスプール上に巻き取られたボンディングワイヤの巻線構造において、本巻き部分の両端形状が形作る少なくとも一方の斜辺にスプール端部から延びる下斜辺の仰角よりも急峻な仰角を有する中斜辺または上斜辺の突起部を形成し、突起部に波型のジグザグ層が連なり、かつ、当該上斜辺の頂点の高さが当該ジグザグ層の平均の高さよりも高くする。【選択図】図２