INFORMATION PROCESSING DEVICE

PROBLEM TO BE SOLVED: To provide an information processing device which can be made compact and in which high density is achieved.SOLUTION: An information processing device comprises: a lower unit comprising a circuit board on which one or plural first electronic components are mounted, and a chassi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KUROSAKI KEITARO, HORI KAZUNORI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an information processing device which can be made compact and in which high density is achieved.SOLUTION: An information processing device comprises: a lower unit comprising a circuit board on which one or plural first electronic components are mounted, and a chassis on whose bottom part, the circuit board is mounted and whose upper surface is open; and an upper unit being laminated to the lower unit, the upper unit comprising a tray member which is detachably attached to the chassis, and one or plural second electronic components which are mounted on a tray bottom part of the tray member. The upper unit comprises a connector board attached to the tray member, the connector board comprising a first connector which is fitted to a board side connector provided on the circuit board, and a second connector electrically connected to the second electronic component(s), the connector board being inserted into a bottom part opening formed on the tray bottom part and being hung from the tray member.SELECTED DRAWING: Figure 1 【課題】小型化・高密度化が可能な情報処理装置を提供する。【解決手段】情報処理装置は、一又は複数の第1電子部品を搭載する回路基板と、底部に回路基板を搭載すると共に上面が開口したシャーシとを有する下部ユニットと、下部ユニットに積層される上部ユニットであってシャーシに対して着脱自在に装着されるトレイ部材と、トレイ部材のトレイ底部に搭載される一又は複数の第2電子部品とを有する上部ユニットと、を備え、上部ユニットは、トレイ部材に装着されるコネクタボードであって、回路基板上に設けられた基板側コネクタに嵌合される第1コネクタと、第2電子部品と電気的に接続される第2コネクタとを有し、トレイ底部に形成された底部開口に挿通されると共にトレイ部材から垂設されるコネクタボードを有する。【選択図】図1