FAN-OUT SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a fan-out semiconductor package and a manufacturing method thereof.SOLUTION: The present invention relates to a fan-out semiconductor package and a manufacturing method thereof. The fan-out semiconductor package includes: a first connection member having a through ho...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE DOO HWAN, KIM HYOUNG JOON, KIM JONG RIP, OH KYUNG SEOB
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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