RESIN COMPOSITION FOR UNDERFILL, ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

PROBLEM TO BE SOLVED: To provide a resin composition for underfill excellent in flowability, filling property, moldability, temperature cycle resistance and moisture resistance, a highly reliable electronic component device at least partially sealed with the resin composition for underfill and a met...

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Bibliographische Detailangaben
Hauptverfasser:	HORI HIROSHI, DEGUCHI OUSHI, NOJIRI NAOYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition for underfill excellent in flowability, filling property, moldability, temperature cycle resistance and moisture resistance, a highly reliable electronic component device at least partially sealed with the resin composition for underfill and a method for producing the electronic component device.SOLUTION: A resin composition for underfill comprises (A) epoxy resin, (B) aromatic amine compound, (C) inorganic filler and (D) organic phosphorus compound.SELECTED DRAWING: None 【課題】流動性、充填性、成形性、耐温度サイクル性及び耐湿性に優れたアンダーフィル用樹脂組成物、並びに該アンダーフィル用樹脂組成物により少なくとも一部が封止された信頼性の高い電子部品装置及び該電子部品装置の製造方法を提供すること。【解決手段】（Ａ）エポキシ樹脂、（Ｂ）芳香族アミン化合物、（Ｃ）無機充填材及び（Ｄ）有機リン化合物を含有してなる、アンダーフィル用樹脂組成物。【選択図】なし