ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To suppress influence of external noises on an electronic component mounted on a substrate.SOLUTION: By insulating a signal ground of a mounting substrate 2 and a frame ground of a housing 3, it is possible to prevent the external noises input to the frame ground from being mix...

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Bibliographische Detailangaben
Hauptverfasser:	HASE HIDEKI, KAKIYA TERUO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To suppress influence of external noises on an electronic component mounted on a substrate.SOLUTION: By insulating a signal ground of a mounting substrate 2 and a frame ground of a housing 3, it is possible to prevent the external noises input to the frame ground from being mixed into the signal ground and to suppress influence of external noises on an electronic component 4 mounted on the mounting substrate 2.SELECTED DRAWING: Figure 1 【課題】基板に実装された電子部品に及ぼす外部ノイズの影響を抑制することを目的とする。【解決手段】実装基板２のシグナルグランドと筐体３のフレームグランドとを絶縁することにより、フレームグランドに入力された外部ノイズがシグナルグランドに混入することを防止し、実装基板２に実装された電子部品４に及ぼす外部ノイズの影響を抑制することができる。【選択図】図１