RESIN COMPOSITION, RESIN SHEET, RESIN SHEET CURED PRODUCT, RESIN SHEET LAMINATE, RESIN SHEET LAMINATE CURED PRODUCT AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR DEVICE AND LED DEVICE

PROBLEM TO BE SOLVED: To provide a resin composition which can form a resin cured product that achieves both high thermal conductivity and high insulation performance.SOLUTION: A resin composition comprises an epoxy resin monomer represented by formula (III), two kinds of novolac resin mixtures diff...

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Hauptverfasser:	MIYAZAKI YASUO, ISOHATA TAKAHIRO, WAKIGUCHI KEITA, NISHIYAMA TOMOO, HARA NAOKI, TAKASE YUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition which can form a resin cured product that achieves both high thermal conductivity and high insulation performance.SOLUTION: A resin composition comprises an epoxy resin monomer represented by formula (III), two kinds of novolac resin mixtures different in chemical structure, and a boron nitride particle with a volume average particle diameter of 20 μm-80 μm and having a hydroxy group, and has Tg of 50°C or less.SELECTED DRAWING: None 【課題】高熱伝導性と高絶縁性を両立する樹脂硬化物を形成可能な樹脂組成物の提供。【解決手段】式（ＩＩＩ）で表されるエポキシ樹脂モノマーと、化学構造の異なる２種類のノボラック樹脂混合物と、体積平均粒子径が２０μｍ〜８０μｍであり水酸基を有する窒化ホウ素粒子と、を含有し、Ｔｇが５０℃以下である樹脂組成物。【選択図】なし