RESIN COMPOSITION FOR LIGHT EMISSION ELEMENT ENCAPSULATION

PROBLEM TO BE SOLVED: To provide a resin composition for light emission element encapsulation excellent in gas barrier property.SOLUTION: There is provided a resin composition for light emission element encapsulation containing an organopolysiloxane composition (I) and a filler (II) having an averag...

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Bibliographische Detailangaben
Hauptverfasser:	TANISADA TOMOKI, AKAHANE JUNJI, SARUKAWA YUTA, IMURA TOSHIFUMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition for light emission element encapsulation excellent in gas barrier property.SOLUTION: There is provided a resin composition for light emission element encapsulation containing an organopolysiloxane composition (I) and a filler (II) having an average particle diameter of 10 to 35 μm and an aspect ratio of 55 to 350, with a concentration of the filler (II) to the total solid component of the resin composition of 7.0 to 10.0 vol%.SELECTED DRAWING: None 【課題】ガスバリア性に優れる発光素子封止用樹脂組成物を提供する。【解決手段】オルガノポリシロキサン組成物（Ｉ）及び平均粒子径が１０〜３５μｍで且つアスペクト比が５５〜３５０であるフィラー（ＩＩ）を含有する樹脂組成物であって、前記樹脂組成物の固形分全量に対する前記フィラー（ＩＩ）の濃度が７．０〜１０．０ｖｏｌ％であることを特徴とする発光素子封止用樹脂組成物。【選択図】なし