METHOD FOR MANUFACTURING FILLING PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To prevent the occurrence of a void even in the case of filling a resin in a drilled space produced by execution of a back drill method and then completely curing the resin.SOLUTION: A method for manufacturing a filling printed wiring board comprises the steps of: removing a surplus portion of a plating through-hole 1 provided in a printed wiring board by a back drill method to form a drilled space 4; filling the whole through-hole with a curable resin composition 6 for hole filling; first heating the filling resin at a temperature under 100°C to cure the filling resin to a curing rate of 60% or more; and then heating the filling resin at a temperature of 130-200°C to totally cure the resin into a fully cured resin 8. [The curable resin composition for hole filling includes 1-200 pts.wt. of a hardening agent per 100 pts.wt. of a liquid epoxy resin, and no solvent.]SELECTED DRAWING: Figure 1 【課題】バックドリル工法を施して生じた掘削空間に、樹脂を充填し完全硬化させた場合でも、ボイドの発生を防ぐ。【解決手段】プリント配線板に設けられたメッキスルーホール１の余剰部分をバックドリル工法にて除去し４、貫通穴全体を下記穴埋め用硬化性樹脂組成物６にて充填し、充填樹脂を、先ず１００℃未満の加熱により硬化率６０％以上とし、次いで１３０〜２００℃の加熱をし、完全硬化８させる。［液状エポキシ樹脂１００重量部につき硬化剤を１〜２００重量部含有し、且つ溶剤を含有しない穴埋め用硬化性樹脂組成物］【選択図】図１