SEMICONDUCTOR WAFER INSPECTION DEVICE AND SEMICONDUCTOR WAFER INSPECTION METHOD
PROBLEM TO BE SOLVED: To provide a semiconductor wafer inspection device which inhibits warp of a semiconductor wafer from being caused by a temperature difference between a placement surface of a table and the semiconductor wafer, and to provide a semiconductor wafer inspection method.SOLUTION: A s...
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| creator | MOTOYAMA TAKASHI YAMAGUCHI AKIRA TAKAHASHI TAKETAKA ISHIMOTO TAKASHI SHIGESAWA YUJI |
| description | PROBLEM TO BE SOLVED: To provide a semiconductor wafer inspection device which inhibits warp of a semiconductor wafer from being caused by a temperature difference between a placement surface of a table and the semiconductor wafer, and to provide a semiconductor wafer inspection method.SOLUTION: A semiconductor wafer inspection device includes: a table 20 having a placement surface 18 on which a semiconductor wafer W is placed; a heater 24 for heating the placement surface 18; and stage pins 28 which hold the semiconductor wafer W at a separation position where the semiconductor wafer W is separated from the placement surface 18. The semiconductor wafer W is preheated while being held at the separation position by the stage pins 28.SELECTED DRAWING: Figure 2
【課題】テーブルの載置面と半導体ウェーハとの温度差に起因する半導体ウェーハの反りを抑制することができる半導体ウェーハの検査装置及び半導体ウェーハの検査方法を提供する。【解決手段】半導体ウェーハＷが載置される載置面１８を有するテーブル２０と、載置面１８を加熱するヒータ２４と、半導体ウェーハＷが載置面１８から離間した離間位置に半導体ウェーハＷを保持するステージピン２８と、を備える。ステージピン２８によって、半導体ウェーハＷを離間位置に保持した状態で予備加熱する。【選択図】図２ |
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【課題】テーブルの載置面と半導体ウェーハとの温度差に起因する半導体ウェーハの反りを抑制することができる半導体ウェーハの検査装置及び半導体ウェーハの検査方法を提供する。【解決手段】半導体ウェーハＷが載置される載置面１８を有するテーブル２０と、載置面１８を加熱するヒータ２４と、半導体ウェーハＷが載置面１８から離間した離間位置に半導体ウェーハＷを保持するステージピン２８と、を備える。ステージピン２８によって、半導体ウェーハＷを離間位置に保持した状態で予備加熱する。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170223&DB=EPODOC&CC=JP&NR=2017041642A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170223&DB=EPODOC&CC=JP&NR=2017041642A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MOTOYAMA TAKASHI</creatorcontrib><creatorcontrib>YAMAGUCHI AKIRA</creatorcontrib><creatorcontrib>TAKAHASHI TAKETAKA</creatorcontrib><creatorcontrib>ISHIMOTO TAKASHI</creatorcontrib><creatorcontrib>SHIGESAWA YUJI</creatorcontrib><title>SEMICONDUCTOR WAFER INSPECTION DEVICE AND SEMICONDUCTOR WAFER INSPECTION METHOD</title><description>PROBLEM TO BE SOLVED: To provide a semiconductor wafer inspection device which inhibits warp of a semiconductor wafer from being caused by a temperature difference between a placement surface of a table and the semiconductor wafer, and to provide a semiconductor wafer inspection method.SOLUTION: A semiconductor wafer inspection device includes: a table 20 having a placement surface 18 on which a semiconductor wafer W is placed; a heater 24 for heating the placement surface 18; and stage pins 28 which hold the semiconductor wafer W at a separation position where the semiconductor wafer W is separated from the placement surface 18. The semiconductor wafer W is preheated while being held at the separation position by the stage pins 28.SELECTED DRAWING: Figure 2
【課題】テーブルの載置面と半導体ウェーハとの温度差に起因する半導体ウェーハの反りを抑制することができる半導体ウェーハの検査装置及び半導体ウェーハの検査方法を提供する。【解決手段】半導体ウェーハＷが載置される載置面１８を有するテーブル２０と、載置面１８を加熱するヒータ２４と、半導体ウェーハＷが載置面１８から離間した離間位置に半導体ウェーハＷを保持するステージピン２８と、を備える。ステージピン２８によって、半導体ウェーハＷを離間位置に保持した状態で予備加熱する。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAPdvX1dPb3cwl1DvEPUgh3dHMNUvD0Cw5wdQ7x9PdTcHEN83R2VXD0c1EgoNLXNcTD34WHgTUtMac4lRdKczMoubmGOHvophbkx6cWFyQmp-allsR7BRgZGJobmBiamRg5GhOlCADPaS-E</recordid><startdate>20170223</startdate><enddate>20170223</enddate><creator>MOTOYAMA TAKASHI</creator><creator>YAMAGUCHI AKIRA</creator><creator>TAKAHASHI TAKETAKA</creator><creator>ISHIMOTO TAKASHI</creator><creator>SHIGESAWA YUJI</creator><scope>EVB</scope></search><sort><creationdate>20170223</creationdate><title>SEMICONDUCTOR WAFER INSPECTION DEVICE AND SEMICONDUCTOR WAFER INSPECTION METHOD</title><author>MOTOYAMA TAKASHI ; YAMAGUCHI AKIRA ; TAKAHASHI TAKETAKA ; ISHIMOTO TAKASHI ; SHIGESAWA YUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017041642A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MOTOYAMA TAKASHI</creatorcontrib><creatorcontrib>YAMAGUCHI AKIRA</creatorcontrib><creatorcontrib>TAKAHASHI TAKETAKA</creatorcontrib><creatorcontrib>ISHIMOTO TAKASHI</creatorcontrib><creatorcontrib>SHIGESAWA YUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOTOYAMA TAKASHI</au><au>YAMAGUCHI AKIRA</au><au>TAKAHASHI TAKETAKA</au><au>ISHIMOTO TAKASHI</au><au>SHIGESAWA YUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR WAFER INSPECTION DEVICE AND SEMICONDUCTOR WAFER INSPECTION METHOD</title><date>2017-02-23</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To provide a semiconductor wafer inspection device which inhibits warp of a semiconductor wafer from being caused by a temperature difference between a placement surface of a table and the semiconductor wafer, and to provide a semiconductor wafer inspection method.SOLUTION: A semiconductor wafer inspection device includes: a table 20 having a placement surface 18 on which a semiconductor wafer W is placed; a heater 24 for heating the placement surface 18; and stage pins 28 which hold the semiconductor wafer W at a separation position where the semiconductor wafer W is separated from the placement surface 18. The semiconductor wafer W is preheated while being held at the separation position by the stage pins 28.SELECTED DRAWING: Figure 2
【課題】テーブルの載置面と半導体ウェーハとの温度差に起因する半導体ウェーハの反りを抑制することができる半導体ウェーハの検査装置及び半導体ウェーハの検査方法を提供する。【解決手段】半導体ウェーハＷが載置される載置面１８を有するテーブル２０と、載置面１８を加熱するヒータ２４と、半導体ウェーハＷが載置面１８から離間した離間位置に半導体ウェーハＷを保持するステージピン２８と、を備える。ステージピン２８によって、半導体ウェーハＷを離間位置に保持した状態で予備加熱する。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR WAFER INSPECTION DEVICE AND SEMICONDUCTOR WAFER INSPECTION METHOD |
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