HOUSING

PROBLEM TO BE SOLVED: To provide a housing which is excellent in thermal conductivity, heat dissipation, impact resistance, and moldability while being lightweight compared to metal.SOLUTION: The housing includes a molding obtained by molding a thermoplastic resin composition. The thermoplastic resi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FURUKAWA MIKIO, MASAI YUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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