HOUSING

PROBLEM TO BE SOLVED: To provide a housing which is excellent in thermal conductivity, heat dissipation, impact resistance, and moldability while being lightweight compared to metal.SOLUTION: The housing includes a molding obtained by molding a thermoplastic resin composition. The thermoplastic resi...

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Bibliographische Detailangaben
Hauptverfasser:	FURUKAWA MIKIO, MASAI YUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a housing which is excellent in thermal conductivity, heat dissipation, impact resistance, and moldability while being lightweight compared to metal.SOLUTION: The housing includes a molding obtained by molding a thermoplastic resin composition. The thermoplastic resin composition contains a thermoplastic resin (A) and a thermally conductive filler (B) having a thermal conductivity of 5 W/(m K) or more. The thermoplastic resin (A) is a polyamide resin (A1) or a polyester resin (A2). The volume ratio (A/B) of the thermoplastic resin (A) to the thermally conductive filler (B) is 80/20 to 25/75.SELECTED DRAWING: None 【課題】金属と比較して軽量でありつつも、熱伝導性、放熱性、耐衝撃性、成形加工性に優れた筐体を提供する。【解決手段】熱可塑性樹脂組成物を成形してなる成形体を含む筐体であって、熱可塑性樹脂組成物が、熱可塑性樹脂（Ａ）、５Ｗ／（ｍ・Ｋ）以上の熱伝導率を有する熱伝導性充填材（Ｂ）を含有し、熱可塑性樹脂（Ａ）がポリアミド樹脂（Ａ１）、ポリエステル樹脂（Ａ２）であり、熱可塑性樹脂（Ａ）と熱伝導性充填材（Ｂ）との容量比（Ａ／Ｂ）が、８０／２０〜２５／７５であることを特徴とする筐体。【選択図】なし