CONVERTER DEVICE AND CONVERTER DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To surely fill a filler into a space between electrical components in a mounted substrate and achieve downsizing.SOLUTION: The converter device, which comprises a mounted substrate 2, a housing 3 for housing the mounted substrate 2 and a lid part 4 which is fitted to the housin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	URATA HIKARI, KITATANI KAZUHARU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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