CONVERTER DEVICE AND CONVERTER DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To surely fill a filler into a space between electrical components in a mounted substrate and achieve downsizing.SOLUTION: The converter device, which comprises a mounted substrate 2, a housing 3 for housing the mounted substrate 2 and a lid part 4 which is fitted to the housing 3 so as to cover an opening part 33 of the housing 3, is configured so that a filler 5 is filled into the housing 3 so as to cover the electrical component 22 of the mounted substrate 2 stored in the housing 3. The housing 3 is formed to have four side plates erected on a bottom plate 31 and respective outer periphery parts of the bottom plate 31 and to have ribs 34 provided on inner faces of the side plates. The mounted substrate 2 is housed in the housing 3 with a mounted surface 21a on which is mounted the electrical component 22 opposing to the bottom plate 31 and the mounted surface 21a contacting the ribs 34. The filler 5 is filled between the bottom plate 31 and the mounted surface 21a. The lid part 4 is fitted to the housing 3 in a state where a protruding part 43 provided on the inner face contacts a backside 21b of the mounted substrate 2 and presses the mounted substrate 2 against the bottom plate 31.SELECTED DRAWING: Figure 10 【課題】実装基板における電気部品間の隙間に充填材を確実に充填すると共に小形化を実現する。【解決手段】実装基板２と、実装基板２を収容する筐体３と、筐体３の開口部３３を覆うように筐体３に装着される蓋部４とを備え、筐体３に収容された実装基板２の電気部品２２を覆うように筐体３内に充填剤５が充填されて構成され、筐体３は、底板３１および底板３１の各外周部に立設された４つの側板を有して形成されると共に、側板の内面にリブ３４が設けられて構成され、実装基板２は、電気部品２２が実装されている実装面２１ａが底板３１に対向しかつリブ３４に実装面２１ａが当接した状態で筐体３に収容され、充填剤５は、底板３１と実装面２１ａとの間に充填され、蓋部４は、内面に設けられた突起部４３が実装基板２の裏面２１ｂに当接して実装基板２を底板３１側に押え付けた状態で筐体３に装着されている。【選択図】図１０